Waferpedia

Comparison ledger

DAD641 versus DFG 840 Automatic

Disco DAD641 and Disco DFG 840 Automatic, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
DAD641Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco DAD641Disco DFG
Specifications
Tool typeDicing saw[1]
LocationBackend Lab[1]
Tool nameDisco DAD641[2]
Phase3 Phase[3]
Configuration50/60 Hz[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]inventory listing