Waferpedia

Comparison ledger

DCS 1440 Wafer Cleaner Spinversus1000P

Disco DCS 1440 Wafer Cleaner Spin, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
OEMDiscoYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Acquisition
Control system——
Generation——
FamilyDisco DCSYES 1000P
Specifications
Configuration5 in. table[1]Parallel plate[4]
Max. workpiece sizeΦ8 inch[2]—
Table RPM100 - 3000 min^-1[2]—
Setting time for cleaning/drying0 - 999 sec[2]—
Cleaning nozzle speed1 - 37.5 °/sec[2]—
Cleaning rangeΦ365 mm (up to 210 x 210 mm)[2]—
Cleaning pressure range2.3 - 11.8 MPa[2]—
Equipment dimensions (W×D×H)400 × 600 × 1220 mm[2]—
Dry massApprox. 124 kg[2]—
Voltage200-240 VAC[1]—
Frequency50/60 Hz[1]—
Table size5 in.[1]—
Arm configurationDouble arm[1]—
Wiring3 Wire + ground[1]—
Model—1000P[3]
System type—Plasma cleaning system[3]
Shelf configuration—Four 16 x 16 inch shelves[3]
Total capacity—1024 square inches[3]
Control system—PLC driven with plain English real time process readout and diagnostics in the event of system abort[3]
Number of shelves—4[3]
Shelf size—16 x 16 inches[3]
Power—1000 W[4]
Operation modes—Active, RIE, Downstream[3]
Sample size range—From smallest semiconductor chip to large flat panels[3]
Type—Plasma cleaning system[3]
Shelves—Four 16 x 16 inch shelves[3]
Control—PLC driven with plain English real time process readout and diagnostics in the event of system abort[3]

Plan your fab

Building a Wet Processing / Clean process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]disco.co.jpdisco.co.jp
  3. [3]web.archive.orgweb.archive.org
  4. [4]semistarcorp.comsemistarcorp.com