Waferpedia

Comparison ledger

DCS1440versus1000P

Disco DCS1440, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
DCS1440Disco
OEMDiscoYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size100mm—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Acquisition
Control system——
Generation——
FamilyDisco DCS1440YES 1000P
Specifications
Mentioned functionatomizing cleaning[1]—
Associated equipmentDAG810 automatic surface grinder[1]—
Maximum workpiece sizeΦ8 inch[2]—
Application frame2-8-1[3]—
Table RPM100 to 3,000 min⁻¹[2]—
Setting time for cleaning/drying0 to 999 sec[2]—
Cleaning nozzle speed1 to 37.5 °/sec[2]—
Cleaning rangeΦ365 mm (up to 250×250 mm)[2]—
Cleaning pressure range2.3 to 11.8 MPa[2]—
Equipment dimensions (W×D×H)400 × 600 × 1,220 mm[2]—
Dry massApprox. 124 kg[2]—
Maximum square workpiece (optional)250×250 mm[2]—
Model—1000P[4]
System type—Plasma cleaning system[4]
Shelf configuration—Four 16 x 16 inch shelves[4]
Total capacity—1024 square inches[4]
Control system—PLC driven with plain English real time process readout and diagnostics in the event of system abort[4]
Number of shelves—4[4]
Shelf size—16 x 16 inches[4]
Power—1000 W[5]
Configuration—Parallel plate[5]
Operation modes—Active, RIE, Downstream[4]
Sample size range—From smallest semiconductor chip to large flat panels[4]
Type—Plasma cleaning system[4]
Shelves—Four 16 x 16 inch shelves[4]
Control—PLC driven with plain English real time process readout and diagnostics in the event of system abort[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]epfl.chepfl.ch
  2. [2]disco.co.jpdisco.co.jp
  3. [3]disco.com.sgdisco.com.sg
  4. [4]web.archive.orgweb.archive.org
  5. [5]semistarcorp.comsemistarcorp.com