Comparison ledger
Disco DFD 6340 Automatic Dicing, Meyer Burger OC 266 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | OC 266 WaferMeyer Burger | |
|---|---|---|
| OEM | Disco | Meyer Burger |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFD 6340 | Meyer Burger OC 266 Wafer |
| Specifications | ||
| Configuration | Missing ZI motor[2] | 150A[8] |
| Phase | 3 Phase[3] | — |
| Voltage | 220 Vac[3] | 400V[1] |
| Make | Disco[2] | — |
| Model | DFD 6340[2] | — |
| Machine type | Automatic dicing saw[2] | — |
| Wafer size | 8 inch[5] | — |
| Electrical configuration | 3 Phase, 3 Wire + Ground, 220 Vac, 50/60 Hz[3] | — |
| Example unit vintage | 2013[2] | — |
| OEM | Disco[2] | — |
| Equipment type | Automatic Dicing Saw[2] | — |
| Electrical | 3 Phase[6] | — |
| Vintage | 2013[2] | — |
| Spindle Power Options | 1.2 / 1.8 / 2.2 kW[7] | — |
| X-axis Cutting Range | 210 mm[7] | — |
| X-axis Cutting Speed | 0.1-600 mm/s[7] | — |
| Y1 / Y2 Axis Cutting Range | 210 mm[7] | — |
| Y-axis Index Step | 0.0001 mm[7] | — |
| Z-axis Repeatability | 0.001 mm[7] | — |
| Main Process | Wafer Dicing / Package Singulation[7] | — |
| Frequency | — | 50 Hz[1] |
| Type | — | wafer saw[1] |
| Category | — | Dicing & Grinding[1] |
| Current | — | 150A[1] |
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