Disco
DFD 6340 Automatic Dicing
The Disco DFD 6340 is an automatic dicing saw for semiconductor wafers. The Disco DFD 6340 supports 8-inch wafer sizes. The Disco DFD 6340 operates on 3-phase, 200–220 VAC, 50/60 Hz power.[1][2][3]
What it is
How it works
General reference — not yet source-verifiedA dicing saw separates processed wafers into individual die by moving a cutting blade along programmed scribe or street locations.
A machine in this class normally combines precision wafer handling, axis motion, and spindle-driven cutting to produce narrow cuts with controlled chip formation.
Where it fits in the process flow
General reference — not yet source-verifiedA dicing saw sits near the end of wafer processing, after front-side device fabrication and before die-level assembly.
The machine supports singulation work that follows wafer preparation and precedes downstream packaging or handling of individual chips.
Applications
General reference — not yet source-verifiedA dicing saw is used for wafer singulation in semiconductor production.
A machine of this class is also used where controlled cutting or grinding is needed on processed wafers or similar precision substrates.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Missing ZI motor
- No elevator
What do the numbers mean?
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Veeco ADS 800 Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[4]
- Accretech AD 3000 T Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[4]
- ADT 8020 Auto Twin Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[4]
- Meyer Burger OC 266 Wafer— Same function class: Dicing & Grinding, nullCompare in depthsource[12]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Phase3 Phase[2]
- Voltage220 Vac[2]
- Configuration50/60 Hz[2]
- Voltage200V[3]
- Electrical configuration3 Phase, 3 Wire + Ground, 220 Vac, 50/60 Hz[2]
- Electrical configuration3 Phase, 50/60 Hz, 200V[3]
- Electrical configuration3 Phase, 50/60 Hz, 3 Wire + Ground[11]
- Electrical3 Phase[11]
- Electrical3 Wire + Ground[11]
- Electrical220 Vac[2]
- Electrical200V[3]
- Electrical50/60 Hz[3]
- Spindle Power Options1.2 / 1.8 / 2.2 kW[10]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DFD 6340 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6340 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6340 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6340 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the DFD 6340 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DFD 6340 Automatic Dicing are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (12)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]Inventory photo
- [9]Inventory photo
- [10]Inventory photo
- [11]Equipment inventory listing
- [12]waferpedia.comwaferpedia.com
Last updated Oct 17, 2026.
Compare with similar tools
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The ADT 8020 Auto Twin Dicing is a fully automatic twin dicing system for 8-inch workpieces.
The Accretech AD 3000 T Dicing is a fully automatic dicing saw for 300 mm wafers.
The Veeco ADS 800 Dicing System is a dicing system configured with a 220 VAC, 3-phase, 50/60 Hz, 30 Amp power requirement and includes motion, control, vision, and coolant delivery components.
The Meyer Burger OC 266 Wafer is a wafer saw in the Dicing & Grinding category.
