Comparison ledger
Disco DFD 6340 Fully Automatic Dicing, Meyer Burger OC 266 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | OC 266 WaferMeyer Burger | |
|---|---|---|
| OEM | Disco | Meyer Burger |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFD 6340 Fully Automatic Dicing | Meyer Burger OC 266 Wafer |
| Specifications | ||
| Maximum workpiece size | ø8"[2] | — |
| X-axis cutting range | 210 mm[2] | — |
| Maximum cutting speed | 600 mm/s[2] | — |
| Y1-axis cutting range | 210 mm[2] | — |
| Y1-axis index step | 0.0001 mm[2] | — |
| Y2-axis index positioning accuracy | 0.002/210 (single error) / 0.002 or less/5[2] | — |
| Z1-axis maximum stroke | 19.22 mm[2] | — |
| Z1-axis moving resolution | 0.00005 mm[2] | — |
| Z2-axis repeatability accuracy | 0.001 mm[2] | — |
| Maximum blade size | ø58 mm[2] | — |
| θ-axis maximum rotating angle | 380°[2] | — |
| Spindle output | 1.2 kW at 60,000 min-1[2] | — |
| Spindle rated torque | 0.19 N·m[2] | — |
| Spindle revolution speed range | 6,000 ~ 60,000 min-1[2] | — |
| Applicable tape frame | 2-8-1[2] | — |
| Power supply | 200 ~ 240 V AC ±10%, 3-phase (50/60 Hz)[2] | — |
| Power consumption (when processing) | 2.1 kW (for reference)[2] | — |
| Power consumption (during warm-up) | 1.8 kW (for reference)[2] | — |
| Maximum power | 6.9 kVA[2] | — |
| Air pressure | 0.5 ~ 0.8 MPa[2] | — |
| Air maximum consumption | 378.0 L/min (ANR)[2] | — |
| N2 pressure | 0.5 ~ 0.8 MPa[2] | — |
| N2 maximum consumption | 216.0 L/min (ANR)[2] | — |
| Cutting water pressure | 0.2 ~ 0.4 MPa[2] | — |
| Cutting water maximum flow rate | 12 L/min[2] | — |
| Water curtain maximum flow rate | 1 L/min[2] | — |
| Other water maximum flow rate | 1 L/min[2] | — |
| Cooling water pressure | 0.2 ~ 0.4 MPa[2] | — |
| Cooling water flow rate | 3.0 L/min at 0.3 MPa[2] | — |
| Exhaust duct capacity | 5.0 m³/min[2] | — |
| Machine dimensions (W x D x H) | 1,180 x 1,110 x 1,850 mm[2] | — |
| Machine weight (without transformer) | Approximately 1,600 kg[2] | — |
| Machine weight (with transformer for overseas use) | Approximately 1,670 kg[2] | — |
| Voltage | — | 400V[1] |
| Configuration | — | 150A[3] |
| Frequency | — | 50 Hz[1] |
| Type | — | wafer saw[1] |
| Category | — | Dicing & Grinding[1] |
| Current | — | 150A[1] |
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