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DFD 6361 Automatic Dicing versus DFL 7560 L

Disco DFD 6361 Automatic Dicing and Disco DFL 7560 L, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Side-by-side comparison of selected equipment models
Attribute
DFD 6361 Automatic DicingDisco
DFL 7560 LDisco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—Robot Wafer handling
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFDDisco DFL
Cited variants—
  • 200mm Fully Automatic wafer handling from/to standard wafer cassette[1]
Specifications
Phase3 Phase[2]—
Configuration3 Wire + Ground[2]Operation by touch panel LCD monitor[1]
Full Load Current18 A[3]—
Machine Main Breaker Rating20 A[3]—
Ampere Rating of Largest Load8 A[3]—
Wafer size—Robot Wafer handling[1]
Wafer—Can be modified at later date to 3”, 4” & 6” wafers and frame[1]
Uninterruptible Power Supply—1[1]
DFD 6361 Automatic Dicing entryDFL 7560 L entry

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]inventory listing