Waferpedia

Comparison ledger

DFD 6361 Automatic Dicing versus DTG 8440

Disco DFD 6361 Automatic Dicing and Disco DTG 8440, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco DFDDisco DTG 8440
Specifications
Phase3 Phase[1]
Configuration3 Wire + Ground[1]Disco DTU 1531 Chiller[3]
Full Load Current18 A[2]
Machine Main Breaker Rating20 A[2]
Ampere Rating of Largest Load8 A[2]
Spindle TypeAir Bearings[3]
External CoolingWater Cooled[3]
Power200-208 V, 50/60 Hz, 3 Phase[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing