Disco
DTG 8440
The Disco DTG 8440 is a grinder. The Disco DTG 8440 has an air-bearing spindle type. The Disco DTG 8440 uses water-cooled external cooling.[1][2]
What it is
How it works
General reference — not yet source-verifiedA dicing and grinding machine combines mechanical thinning with wafer singulation-related processing. A wafer is held on a support system while abrasive or cutting actions remove material from the back side or along planned separation lines, depending on the process sequence used.
An air-bearing spindle supports rotation with reduced mechanical contact. Water cooling removes heat from the tool during operation.
Where it fits in the process flow
General reference — not yet source-verifiedA dicing and grinding machine sits in the back-end wafer process flow after front-end device fabrication. The machine is used before or alongside separation into individual dies.
Grinding is used when wafer thinning is needed. Dicing is used when chips must be separated from the wafer.
Applications
General reference — not yet source-verifiedMachines of this class are used for semiconductor wafers that need thinning, singulation, or both.
The class is common in packaging-related flows where finished wafer thickness and controlled die separation are important.
What do the numbers mean?
Power & electrical1
Vacuum & pumping2
- Disco LEM 40 SSU Vacuum Unit[1]
Dimensions & facilities1
Configuration & options7
- Disco DTU 1531 Chiller[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DTG 8440 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DTG 8440 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DTG 8440 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DTG 8440 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DTG 8440 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DTG 8440 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 10, 2026.
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