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Comparison ledger

DFD 641 Automatic DicingversusDTG 8440

Disco DFD 641 Automatic Dicing, Disco DTG 8440, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFDDisco DTG 8440
Specifications
ConfigurationNon-operational[1]Disco DTU 1531 Chiller[3]
OEMDisco[1]Disco[3]
ModelDFD 641[1]DTG 8440[3]
Tool typeAutomatic dicing saw[1]—
CategoryDicing & Grinding[2]Dicing & Grinding[4]
Spindle Type—Air Bearings[3]
External Cooling—Water Cooled[3]
Power—200-208 V, 50/60 Hz, 3 Phase[3]
Machine type—Grinder[3]
Vacuum unit—Disco LEM 40 SSU Vacuum Unit[3]
Chiller—Disco DTU 1531 Chiller[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com