Comparison ledger
Disco DFG 840 Automatic, Disco Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DFG 840 AutomaticDisco | DicingDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFG | Disco Dicing |
| Cited variants | — |
|
| Specifications | ||
| Phase | 3 Phase[2] | — |
| Configuration | 50/60 Hz[3] | Parts Tool[4] |
| Manufacturer | Disco[2] | — |
| Model | DFG 840 Automatic[2] | -[4] |
| Equipment type | Automatic grinder[2] | Dicing saw[4] |
| Category | Dicing & Grinding[2] | — |
| Wafer size | 8 inch[2] | — |
| Frequency | 50/60 Hz[2] | — |
| Electrical | AC 200 V[2] | — |
| Vintage | 1995[2] | — |
| Oil mist filtration system | Pure Boyd PBH 100 Oil Mist Filtration System[3] | — |
| Substrate size | — | up to 8 inches[5] |
| Substrate thickness | — | up to 1.25 mm[5] |
| Spindle | — | 2” front-mount, air driven DC brushless, closed-loop control[5] |
| Y-axis | — | closed-loop linear encoder[5] |
| Height sensing | — | non-contact optical[5] |
| Pattern recognition | — | auto-focusing and programmable illumination[5] |
| Maximum substrate thickness | — | up to 1.25 mm[5] |
| Applications | — | dicing of silicon, bonded Si wafers, and all types of glasses[5] |
| Tool type | — | Dicing saw[5] |
| Cutting range | — | 160 mm x 162 mm[1] |
| Max substrate size | — | 6” wafers or 6″ x 6″ substrates[1] |
| Cutting blade thickness | — | 100 – 400 micron[1] |
| Positioning accuracy | — | < 0.005/160[1] |
| Spindle power/speed | — | 1.5 kW spindle at 30,000 per minute[1] |
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