Comparison ledger
Disco DFL 7160 Automatic, Disco Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DFL 7160 AutomaticDisco | DicingDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFL 7160 | Disco Dicing |
| Cited variants |
|
|
| Specifications | ||
| Configuration | 1 Cassette port[3] | Parts Tool[5] |
| Wafer Size | 12 inch[3] | — |
| Cassette Ports | 1[3] | — |
| Dicing | Yes[4] | — |
| Circular Ring Cutting of Taiko Wafers | Yes[4] | — |
| Automation | Automatic[1] | — |
| Substrate size | — | up to 8 inches[6] |
| Substrate thickness | — | up to 1.25 mm[6] |
| Spindle | — | 2” front-mount, air driven DC brushless, closed-loop control[6] |
| Y-axis | — | closed-loop linear encoder[6] |
| Height sensing | — | non-contact optical[6] |
| Pattern recognition | — | auto-focusing and programmable illumination[6] |
| Equipment type | — | Dicing saw[5] |
| Model | — | -[5] |
| Maximum substrate thickness | — | up to 1.25 mm[6] |
| Applications | — | dicing of silicon, bonded Si wafers, and all types of glasses[6] |
| Tool type | — | Dicing saw[6] |
| Cutting range | — | 160 mm x 162 mm[2] |
| Max substrate size | — | 6” wafers or 6″ x 6″ substrates[2] |
| Cutting blade thickness | — | 100 – 400 micron[2] |
| Positioning accuracy | — | < 0.005/160[2] |
| Spindle power/speed | — | 1.5 kW spindle at 30,000 per minute[2] |
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