Comparison ledger
Disco DFL 7161, Hitachi 1305 BSG 3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DFL 7161Disco | 1305 BSG 3Hitachi |
|---|---|---|
| OEM | Disco | Hitachi |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFL 7161 | Hitachi 1305 BSG 3 |
| Specifications | ||
| Processing method | Ablation[1] | — |
| Max workpiece size | Φ300 mm[1] | — |
| X-axis Processing range | 310 mm[1] | — |
| X-axis Moving speed | 1 - 1000 mm/s[1] | — |
| Y-axis Processing range | 310 mm[1] | — |
| Y-axis Index step | 0.0001 mm[1] | — |
| Y-axis Positioning accuracy | 0.003/310 (Single error) 0.002/5[1] | — |
| Z-axis Moving resolution | 0.000015 mm[1] | — |
| Z-axis Repeatability accuracy | 0.002 mm[1] | — |
| θ-axis Max. rotating angle | 330 deg (standard) 380 deg (option)[1] | — |
| Equipment dimensions (W×D×H) | 1560 × 1550 × 1800 mm[1] | — |
| Equipment weight | Approx. 2300 kg[1] | — |
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