Disco
DFL 7161
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco DFL 7161 is a fully automatic laser saw for 300 mm wafers. The DFL 7161 uses an ablation processing method. The DFL 7161 integrates HogoMax coating and automatic cleaning sections to reduce waiting time.[1]
What it is
The DFL7161 is a fully automatic laser saw for φ300 mm wafers. The DFL7161 performs a series of processes from HogoMax coating and dicing to automatic cleaning. The HogoMax coating and cleaning sections are located separately to reduce waiting time.[1]
How it works
The DFL7161 uses the ablation processing method. A water-soluble protective film named HogoMax is applied to the wafer surface before processing to prevent laser particles from adhering. The system then performs laser ablation along the dicing streets. After dicing the wafer is automatically cleaned. A kerf check function is installed as standard to automatically monitor and adjust the laser cut position.[1]
Applications
The DFL7161 supports applications for removing TEG on low-k grooves or streets and performing full cut for Si and compound semiconductors. The DFL7161 is a standard laser grooving model. The kerf check function allows stable processing across these applications.[1]
What do the numbers mean?
Optics & imaging1
Performance2
Dimensions & facilities2
Configuration & options7
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the maximum workpiece size supported by the DFL7161?
The maximum workpiece size is φ300 mm.[1]
What processing method does the DFL7161 use?
The DFL7161 uses the ablation processing method.[1]
What is the X-axis moving speed range of the DFL7161?
The X-axis moving speed range is 1 to 1000 mm/s.[1]
Does the DFL7161 include a kerf check function?
Yes, a kerf check function is installed as a standard specification.[1]
What applications does the DFL7161 support?
The DFL7161 supports removing TEG on low-k grooves or streets and performing full cut for silicon and compound semiconductors.[1]
Not publicly documented
The following facts about the DFL 7161 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL 7161 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFL 7161 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFL 7161 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFL 7161 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFL 7161 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]disco.co.jp — disco.co.jpdisco.co.jp
- [2]Equipment inventory listing
Last updated Oct 20, 2026.
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