Comparison ledger
Disco DFL 7340 Stealth Laser Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 15Lapmaster | |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFL 7340 | Lapmaster 15 |
| Specifications | ||
| Configuration | Power supply removed[1] | — |
| OEM | Disco[2] | — |
| Model | DFL7340[2] | — |
| Process area | Packaging[2] | — |
| Purpose | Laser Stealth dicing of Si wafers[3] | — |
| Applications field | Contact-less dicing of Silicon wafers PICs, MEMS, BIO-MEMS and Semiconductor non-wet dicing[3] | — |
| Wavelength | 1342 nm[2] | — |
| Maximum sample diameter | 200 mm[2] | — |
| Wafer size | 200 mm or smaller[3] | — |
| Compatible materials | Si wafers only[2] | — |
| Dicing orientation | Topside or backside (through tape) dicing possible[2] | — |
| Position accuracy | 3 µm[3] | — |
| Feeding speed | 1.0–1000 mm/s[3] | — |
| Input Power | — | 110 Vac[4] |
| Plate Diameter | — | 15 inches (381 mm)[5] |
| Number of Conditioning Rings | — | 3[5] |
| Ring ID | — | 5.5 inches (140 mm)[5] |
| Standard RPM | — | 60[5] |
| RPM Range (Variable Speed Drive) | — | 0-60[5] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[5] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[5] |
| Length | — | 25 inches (635 mm)[5] |
| Width | — | 20 inches (508 mm)[5] |
| Height | — | 24 inches (610 mm)[5] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[5] |
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