Waferpedia

Comparison ledger

DFL 7361 versus DTG 8460 Taiko

Disco DFL 7361 and Disco DTG 8460 Taiko, side by side. Every value shown is drawn from its cited encyclopedia entry.

LinkedIn X Email
Side-by-side comparison of selected equipment models
Attribute
DFL 7361Disco
DTG 8460 TaikoDisco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeIntegrated Wafer Cleaning System with Atomizing Nozzle—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFLDisco DTG 8460
Cited variants
  • SECS/GEM Software[1]
  • Intemal lighting[1]
  • Virus-free PC[1]
  • STM DFL7161 2021 SW unified[1]
  • Barcode reading function for auto recipe loading[1]
  • Compatibility with Hogomax 5L tanks[1]
  • Change of Laser Focus Position for Maintenance[1]
  • Additional Kerf check sequence[1]
  • Password Modification up to Level 4[1]
  • Disco CO2 Injector + Integration specs[1]
  • CO2 injector (stand-alone) added[1]
  • Addition of drain valve for CO 2 injector specific resistance value stabilization[1]
  • CO2 water target resistivity value Settable in device data[1]
  • CO2 bubbler support (RS232C)[1]
  • New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)[1]
—
Specifications
ConfigurationType FX Laser Head[1]3 Chucks[2]
Wafer sizeIntegrated Wafer Cleaning System with Atomizing Nozzle[1]—
Phase—200-2008 V, 50 A, 50/60 Hz, 3 Phase[2]
DFL 7361 entryDTG 8460 Taiko entry

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing