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Comparison ledger

DFL 7361 versus KR15

Disco DFL 7361 and Disco KR15, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Side-by-side comparison of selected equipment models
Attribute
DFL 7361Disco
KR15Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeIntegrated Wafer Cleaning System with Atomizing Nozzle8"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFLDisco KR15
Cited variants
  • SECS/GEM Software[1]
  • Intemal lighting[1]
  • Virus-free PC[1]
  • STM DFL7161 2021 SW unified[1]
  • Barcode reading function for auto recipe loading[1]
  • Compatibility with Hogomax 5L tanks[1]
  • Change of Laser Focus Position for Maintenance[1]
  • Additional Kerf check sequence[1]
  • Password Modification up to Level 4[1]
  • Disco CO2 Injector + Integration specs[1]
  • CO2 injector (stand-alone) added[1]
  • Addition of drain valve for CO 2 injector specific resistance value stabilization[1]
  • CO2 water target resistivity value Settable in device data[1]
  • CO2 bubbler support (RS232C)[1]
  • New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)[1]
  • KR15-A/KR15-B[2]
Specifications
ConfigurationType FX Laser Head[1]—
Wafer sizeIntegrated Wafer Cleaning System with Atomizing Nozzle[1]—
Blade designation—Disco KR15[3]
Blade thickness—200 micron[3]
Blade grit—low grit[3]
Intended materials—sapphire, glass, and silicon[3]
Max. workpiece size—Φ8"[3]
Thickness—200 micron[3]
Grit—Low grit[3]
DFL 7361 entryKR15 entry

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]thk.comthk.com
  3. [3]aggiefab.tamu.eduaggiefab.tamu.edu