Comparison ledger
Disco DFL 7560 L and Disco KR15, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DFL 7560 LDisco | KR15Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | Robot Wafer handling | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFL | Disco KR15 |
| Cited variants |
|
|
| Specifications | ||
| Wafer size | Robot Wafer handling[1] | — |
| Wafer | Can be modified at later date to 3”, 4” & 6” wafers and frame[1] | — |
| Configuration | Operation by touch panel LCD monitor[1] | — |
| Uninterruptible Power Supply | 1[1] | — |
| Blade designation | — | Disco KR15[3] |
| Blade thickness | — | 200 micron[3] |
| Blade grit | — | low grit[3] |
| Intended materials | — | sapphire, glass, and silicon[3] |
| Max. workpiece size | — | Φ8"[3] |
| Thickness | — | 200 micron[3] |
| Grit | — | Low grit[3] |
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