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Comparison ledger

DGP 8760 + DFM 2800 versus KR15

Disco DGP 8760 + DFM 2800 and Disco KR15, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Side-by-side comparison of selected equipment models
Attribute
DGP 8760 + DFM 2800Disco
KR15Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—8"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DGP 8760Disco KR15
Cited variants—
  • KR15-A/KR15-B[1]
Specifications
ConfigurationFully automatic[2]—
Blade designation—Disco KR15[3]
Blade thickness—200 micron[3]
Blade grit—low grit[3]
Intended materials—sapphire, glass, and silicon[3]
Max. workpiece size—Φ8"[3]
Thickness—200 micron[3]
Grit—Low grit[3]
DGP 8760 + DFM 2800 entryKR15 entry

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Sources (3)Every fact above is drawn from these public sources
  1. [1]thk.comthk.com
  2. [2]inventory listing
  3. [3]aggiefab.tamu.eduaggiefab.tamu.edu