Disco
DGP 8760 + DFM 2800
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco DGP 8760 + DFM 2800 is a fully automatic wafer grinding system. The Disco DGP 8760 + DFM 2800 supports 8-inch and 12-inch wafer sizes. The Disco DGP 8760 + DFM 2800 includes an inline UV irradiation system.[1]
What it is
The Disco DGP 8760 + DFM 2800 is dicing and grinding equipment for semiconductor wafers. The Disco DGP 8760 + DFM 2800 is specified for 8 inch and 12 inch wafers. The Disco DGP 8760 + DFM 2800 is fully automatic. The Disco DGP 8760 + DFM 2800 can be configured as stand-alone BG or in-line with a wafer mounter.[1]
How it works
General reference — not yet source-verifiedWafer backgrinding removes material from the backside while the device side is protected by tape and handling fixtures. Dicing equipment then follows cut paths through the wafer and tape stack to separate individual chips. Inline ultraviolet exposure is commonly used with dicing tape workflows to modify tape adhesion for easier die handling after singulation.
Where it fits in the process flow
General reference — not yet source-verifiedDicing and grinding equipment is used after front-end device fabrication and after wafer test preparation stages that leave the wafer ready for thinning or singulation. The equipment sits near the end of wafer processing and before die handling, assembly, and packaging operations.
Applications
General reference — not yet source-verifiedDicing and grinding systems are used where wafers must be thinned and then separated into individual dies. Such equipment is applied in semiconductor device manufacturing flows that require backside thinning, tape-supported handling, and singulation before packaging.
What do the numbers mean?
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Strasbaugh 7 AF Back— Same function class: Dicing & Grinding, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Power200 Vac, 3 Phase[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the Disco DGP 8760 + DFM 2800 support?
The Disco DGP 8760 + DFM 2800 is specified for 8 inch and 12 inch wafers.[1]
Is the Disco DGP 8760 + DFM 2800 automatic?
The Disco DGP 8760 + DFM 2800 is fully automatic.[1]
Can the Disco DGP 8760 + DFM 2800 run as a stand-alone tool or in-line?
The Disco DGP 8760 + DFM 2800 can be configured as stand-alone BG or in-line with a wafer mounter.[1]
Does the Disco DGP 8760 + DFM 2800 include UV capability?
The Disco DGP 8760 + DFM 2800 includes an inline UV irradiation system.[1]
Not publicly documented
The following facts about the DGP 8760 + DFM 2800 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DGP 8760 + DFM 2800 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DGP 8760 + DFM 2800 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DGP 8760 + DFM 2800 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DGP 8760 + DFM 2800 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DGP 8760 + DFM 2800 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Oct 19, 2026.
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