Comparison ledger
EV Group 101, Nikon S 308 F, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | S 308 FNikon |
|---|---|---|
| OEM | EV Group | Nikon |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | Nikon S 308 F |
| Specifications | ||
| OEM | EV Group[1] | — |
| Model | 101[1] | — |
| Equipment name | EVG 101 Spray Coater[1] | — |
| NEMO ID | evgspraycoat[1] | — |
| Training required | EVG 101 Training[1] | — |
| Training duration | 1.50 hours[1] | — |
| Processing technique | Resist Spray Coat (manual)[1] | — |
| Cleanliness | "All"[1] | — |
| Location | SNF Paul G Allen L107 Cleanroom[1] | — |
| Wafer diameter (substrate size) | up to 300 mm[2] | — |
| Available modules | Spin coat / OmniSpray® / develop[2] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[2] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[3] | — |
| Cleanliness group (at SNF) | "All"[1] | — |
| Configuration | — | HDD included[4] |
| Light source | — | ArF (193 nm)[5] |
| Numerical aperture | — | 0.92[5] |
| Exposure area | — | 26 x 33 mm[5] |
| Reduction ratio | — | 1:4[5] |
| Resolution | — | <65 nm[5] |
| Throughput (300 mm) | — | >145 wph[5] |
| Throughput (200 mm) | — | >165 wph[5] |
| Wafer size | — | 200/300 mm[5] |
| Overlay accuracy | — | 8 nm[5] |
| Polarization control | — | POLANO[5] |
| Wafer size (alternative) | — | 12 inch[4] |
| Wavelength | — | 193 nm[5] |
| Lens NA | — | 0.92[5] |
| Polarization Control | — | POLANO (optional)[5] |
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