EV Group
101
The EVG 101 is an advanced resist processing system from EV Group, performing spin or spray coating and developing on wafers up to 300 mm. The EVG 101 supports automated spin or spray coating and developing with manual wafer load and unload. The EVG 101 uses EVG's OmniSpray coating technology for uniform coating of high-topography wafer surfaces.[1]
What it is
The EVG 101 is a resist-processing system designed for single-wafer research and development and small-scale production.[1]
The system supports wafers up to 300 mm in diameter and can be configured for automated spin coating, spray coating, or developing, with manual wafer load and unload.[1]
At the Stanford Nanofabrication Facility, the EVG 101 is classified as a spray coater and belongs to the "All" cleanliness group.[2][4]
How it works
Spray coating aerosolizes photoresist and sprays it through a nozzle that sweeps across the substrate.[3]
The EVG 101 uses a syringe dispense system to handle small resist volumes, including high-viscosity resists up to 52000 cP.[1]
The system offers OmniSpray coating technology for conformal layers on three-dimensionally structured wafers, ensuring uniform coverage of high-aspect-ratio features such as tall pillars or deep trenches.[1][3]
The EVG 101 can be equipped with options for wax and epoxy coating for bonding processes, as well as spin-on-glass coating.[1]
Where it fits in the process flow
Applications
Applications include conformal coating of three-dimensionally structured wafers for interconnection techniques, such as through-silicon vias and microelectromechanical systems.[1][3]
The system also supports developing and can be used for wax and epoxy coating in bonding processes, as well as spin-on-glass coating for planarization or dielectric layers.[1]
- Spray coating of resists
What do the numbers mean?
Vacuum & pumping1
- Dispense options
- Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[1]
Wafer handling2
Gas & chemistry2
Configuration & options10
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the EVG 101 support?
The EVG 101 supports wafers up to 300 mm in diameter.[1]
What coating and developing methods are available on the EVG 101?
The system can be configured for spin coating, spray coating, and developing, all automated with manual wafer load/unload.[1]
What is OmniSpray technology used for on the EVG 101?
OmniSpray is used for conformal coating of three-dimensionally structured wafers to achieve uniform resist layers over high-aspect-ratio features.[1]
What resist viscosities can the EVG 101 handle?
The system can handle resist viscosities up to 52000 cP using a syringe dispense system.[1]
Can the EVG 101 handle bowed or warped wafers?
Yes, the system offers options for bowed, warped, and thin wafer handling, including edge handling.[1]
Not publicly documented
The following facts about the 101 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 101 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 101 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 101 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 101 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 101 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]evgroup.com — evgroup.comevgroup.com
- [2]snfguide.stanford.edu — snfguide.stanford.edusnfguide.stanford.edu
- [3]snfguide.stanford.edu — snfguide.stanford.edusnfguide.stanford.edu
- [4]"All" | Stanford Nanofabrication Facility — snfguide.stanford.edusnfguide.stanford.edu
Last updated Aug 13, 2026.
