Comparison ledger
EV Group 101, OAI Model 800E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | Model 800EOAI |
|---|---|---|
| OEM | EV Group | OAI |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | OAI Model 800E |
| Specifications | ||
| OEM | EV Group[1] | — |
| Model | 101[1] | — |
| Equipment name | EVG 101 Spray Coater[1] | — |
| NEMO ID | evgspraycoat[1] | — |
| Training required | EVG 101 Training[1] | — |
| Training duration | 1.50 hours[1] | — |
| Processing technique | Resist Spray Coat (manual)[1] | — |
| Cleanliness | "All"[1] | — |
| Location | SNF Paul G Allen L107 Cleanroom[1] | — |
| Wafer diameter (substrate size) | up to 300 mm[2] | — |
| Available modules | Spin coat / OmniSpray® / develop[2] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[2] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[3] | — |
| Cleanliness group (at SNF) | "All"[1] | — |
| Product category | — | Mask aligner[4] |
| Operation mode | — | Semi-automatic[5] |
| Exposure sides | — | Frontside and backside[5] |
| Feature level | — | Advanced features and specifications found most often in costly automated production mask aligners[5] |
| System type | — | Front & backside semi-automatic mask aligner[6] |
| Platform | — | Built on OAI's modular platform[6] |
| Control system | — | Windows 10 control and recipe storage[7] |
| Alignment stages | — | Joystick-controlled alignment and optics stages[6] |
| Exposure modes | — | Vacuum contact, hard contact, soft contact, proximity[7] |
| Substrate size | — | Up to 8" square[7] |
| Mask size | — | Up to 9" x 9"[7] |
| Alignment cameras | — | Dual 1 MP GIGE CCD cameras; 4 total in backside configuration[7] |
| Wedge correction | — | Non-contact 3-point wedge effect correction / auto wedge effect compensation[7] |
| Optics | — | OAI Advanced Beam Optics[6] |
| UV source | — | High-intensity broadband Hg/Hg-Xe arc lamp (320-450 nm)[8] |
| Beam uniformity | — | Exceptional uniformity[6] |
| Resolution | — | Sub-micron capability with optimized resist and process[8] |
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