Comparison ledger
EV Group 301 and EV Group 301 Cleaning, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 301EV Group | 301 CleaningEV Group |
|---|---|---|
| OEM | EV Group | EV Group |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | Manual wafer loading |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 301 | EV Group 301 Cleaning |
| Specifications | ||
| Cleaning type | Aqueous-based (DI water) megasonic cleaning[1] | — |
| Spinner rotation | Up to 3000 RPM[1] | — |
| DI-water flow rate | Up to 1.5 l/min[1] | — |
| Megasonic nozzle frequency | 1 MHz[1] | — |
| Megasonic nozzle output power | 30–60 W[1] | — |
| Bonding station | Direct bonding (flat to flat) station[1] | — |
| Inspection module | IR-inspection (lamp/camera) module[1] | — |
| Environment | Class 1 mini environment with HEPA filters and ionizer[1] | — |
| Wafer diameter | 200 mm, 100 - 300 mm[2] | — |
| Cleaning system | Aqueous-based (DI water) megasonic cleaning; solvent cleaning option[1] | — |
| Pre-bonding station | Direct bonding (flat to flat) station[1] | — |
| IR-inspection module | IR-inspection (lamp/camera) module[1] | — |
| Class 1 mini environment | HEPA filters + ionizer[1] | — |
| Brush scrubbing option | Available for single-side cleaning[2] | — |
| Configuration | — | with camera for bond void inspection[3] |
| Wafer size | — | Manual wafer loading[3] |
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