EV Group

301

Wet Processing / Clean EV Group 301 family

Research Quality: 40% complete

The EVG 301 is a single wafer cleaning system for R&D applications. The EVG 301 features megasonic cleaning with a 1 MHz nozzle and spinner rotation up to 3000 rpm. The EVG 301 can be configured with a pre-bonding station and an IR-inspection module.^[1]^[2]

Power

1 MHz^[2]

Optics

IR-inspection (lamp/camera) module^[2]

What is it?

The EVG 301 is described as a megasonic cleaning system and pre-bonding station. The listed capabilities include aqueous-based (DI water) megasonic cleaning, spinner rotation up to 3000 RPM, DI-water flow up to 1.5 l/min, a megasonic nozzle with 1 MHz frequency and 30–60 W output power, a direct bonding (flat to flat) station, an IR-inspection module, and a Class 1 mini environment with HEPA filters and an ionizer.

What can it run?

Process applications and technology nodes documented for this tool.

Megasonic wafer cleaning
Pre-bonding
IR inspection

What do the numbers mean?

Power & electrical2

Megasonic nozzle frequency: 1 MHz^[2]
Megasonic nozzle frequency: 1 MHz (3 MHz option)^[1]

Wafer handling1

Wafer diameter: 200 mm, 100 - 300 mm^[1]

Gas & chemistry1

Cleaning system: Aqueous-based (DI water) megasonic cleaning; solvent cleaning option^[2]

Optics & imaging2

Inspection module: IR-inspection (lamp/camera) module^[2]
IR-inspection module: IR-inspection (lamp/camera) module^[2]

Configuration & options9

Cleaning type: Aqueous-based (DI water) megasonic cleaning^[2]
Spinner rotation: Up to 3000 RPM^[2]
DI-water flow rate: Up to 1.5 l/min^[2]
Megasonic nozzle output power: 30–60 W^[2]
Bonding station: Direct bonding (flat to flat) station^[2]
Environment: Class 1 mini environment with HEPA filters and ionizer^[2]
Pre-bonding station: Direct bonding (flat to flat) station^[2]
Class 1 mini environment: HEPA filters + ionizer^[2]
Brush scrubbing option: Available for single-side cleaning^[1]

Interested in this tool?

Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Megasonic nozzle frequency1 MHz^[2]
Megasonic nozzle frequency1 MHz (3 MHz option)^[1]
Cleaning systemAqueous-based (DI water) megasonic cleaning; solvent cleaning option^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 301 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 301 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 301 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 301 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 301 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 301 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources

[1]evgroup.com — evgroup.comevgroup.com
[2]epfl.ch — epfl.chepfl.ch
[3]Packaging – Miscellaneous ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
[4]https://www.epfl.ch/research/facilities/cmi/wp-content/uploads/2024/10/EVG510_manual_2024.pdf — epfl.chepfl.ch