Comparison ledger
EV Group EVG 150 and EV Group IQ Mask, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | EVG 150EV Group | IQ MaskEV Group |
|---|---|---|
| OEM | EV Group | EV Group |
| Category | Lithography | Lithography |
| Wafer size | 100mm | Motorized swivel arm Wafer loading trays required for desired wafer size ic devices. |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | i-line | — |
| Family | EV Group EVG 150 | EV Group IQ Mask |
| Specifications | ||
| Tool type | Modular cluster tool for coating and development of i-line photoresists[1] | — |
| Loading/unloading ports | Two loading/unloading ports: one cassette for coating and one cassette for development[1] | — |
| Wafer centering | Optical wafer centering station[1] | — |
| Spin-coating modules | Three spin-coating modules: coater A, coater B, and coater C[1] | — |
| Coater A use | Low-viscosity photoresist[1] | — |
| Coater B use | High-viscosity photoresist[1] | — |
| Coater C use | Bottom layers[1] | — |
| Development module | One development module with puddle and spray options[1] | — |
| Hotplates and coolplates | Three stacks of hotplates (8 in total) and coolplates (3 in total)[1] | — |
| HMDS priming | Additional HMDS-priming module[1] | — |
| Robot | Dual end effector robot[1] | — |
| Wafer handling | Standard SEMI-wafers of 100 mm and 150 mm diameter[1] | — |
| Substrate types | Opaque wafers (silicon, SOI) or transparent wafers (glass, fused-silica, sapphire)[1] | — |
| Process stability features | Airborne molecular contamination (AMC) filter and active control of chamber and resist/developer lines temperature[1] | — |
| Available photoresists | AZ ECI 3007, AZ ECI 3027, AZ 1512 HS, AZ nLOF 2020, AZ nLOF 2070, MC PC62E[1] | — |
| Available bottom layers | LOR 5A, LOR 15C, XHRiC-16 II[1] | — |
| Surface preparation options | HMDS, dehydrate, or none[1] | — |
| Solvent clean options | Standard or edge bead removal (EBR)[1] | — |
| Developer chemistries | AZ 726 MIF, AZ 400K 1:3.5, AZ developer III[1] | — |
| Configuration | — | Dual end effector robot handling configuration.[2] |
| Reinforced stage drives | — | X/Y/Theta axis Internal wedge compensation unit: Automatic wedge compensation Substrate and mask.[2] |
| Power | — | 500W or 1000W Hg lamps house Optical sets:[2] |
| Wafer size | — | Motorized swivel arm Wafer loading trays required for desired wafer size ic devices.[2] |
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