Comparison ledger
Finetech Fineplacer Lambda Sub Micron, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Fineplacer Lambda Sub MicronFinetech | 10100West Bond |
|---|---|---|
| OEM | Finetech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2017 Vintage year | — |
| Control system | — | — |
| Generation | — | — |
| Family | Finetech Fineplacer Lambda | West Bond 10100 |
| Specifications | ||
| Configuration | HDD and Software[1] | — |
| Accuracy | 0.5 µm[1] | — |
| Bonding force module | FD3[2] | — |
| Chip heating module | Included[2] | — |
| Optional dispensing module | FG3[1] | — |
| Software | WinFlipChip version 3.2 Revision 052[1] | — |
| PC | Included[2] | — |
| HDD | Included[1] | — |
| Category | Packaging & Bonding[2] | — |
| Equipment type | Die bonder[1] | — |
| Placement accuracy | 0.5 µm[2] | — |
| Dispensing module | Optional FG3[2] | — |
| HDD and Software | Included[1] | — |
| Vintage | 2017[1] | — |
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