Comparison ledger
GCA 6100 C Wafer and GCA AS200, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 6100 C WaferGCA | AS200GCA |
|---|---|---|
| OEM | GCA | GCA |
| Category | Lithography | Lithography |
| Wafer size | 100mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | i-line |
| Family | GCA 6100 C Wafer | GCA AS200 |
| Specifications | ||
| Configuration | Maximus 1000 Light Source (350w)[1] | — |
| Wafer size | 100 mm AWH1 (Automatic Wafer Handler)[1] | — |
| Lens | 10X g-line (436), NA=0.28[1] | Tropel i-line Lens[2] |
| Equipment Rack | (Top Down)[1] | — |
| Model | — | AS200[2] |
| OEM | — | GCA[2] |
| Machine name | — | AutoStep 200 DSW i-line Wafer Stepper[2] |
| Reduction | — | 5X[2] |
| Maximum wafer size | — | up to 200 mm wafers[2] |
| Wafer stage | — | 200 mm Wafer Stage[2] |
| Optics NA | — | 0.45 N.A.[2] |
| Exposure field | — | 15 mm[2] |
| Alignment | — | uDFAS Die-by-Die Alignment[2] |
| Illumination | — | Annular and Quadrupole illumination available[2] |
| Feature size specification | — | 0.65 µm features[2] |
| Overlay specification | — | <0.125 µm using local alignment[2] |
| Focus repeatability | — | <0.2 µm[2] |
| Automation | — | All operations are automated, including wafer loading, aligning, reticle loading and aligning[2] |
| Wafer leveling | — | Used to provide optimum focus range[2] |
| Automatic calibrations | — | All tool calibrations are performed automatically[2] |
| Focus compensation | — | Compensated for lens heating and barometric shifts[2] |
| Reticle management | — | Reticle Management System (up to 10 reticles)[2] |
Plan your fab
Building a Lithography process? Get a complete equipment list.
Open the fab equipment planner →