GCA

AS200

Lithography 200mmi-lineGCA AS200 family

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AS200 — cnfusers.cornell.edu — Fig. 01AS200cnfusers.cornell.edu^[1]

Plate 01How to Properly Install the AS200 Drill Stand
AGP Power ToolsWatch on YouTube
Plate 02AS-200 Automated Packaging Scale
Glenn FarkasWatch on YouTube
Plate 03Caixas do gradiente as 200 abertas.. troca de falantes✌👏💪
Jucelio Santos Watch on YouTube

Wafer size

200mm

Performance

uDFAS Die-by-Die Alignment^[1]

Optics

0.45 N.A.^[1]

What is it?

The sources describe the GCA AS200 as the AutoStep 200 DSW i-line wafer stepper. It is a 5X reduction wafer exposure tool with automated wafer loading and alignment, reticle loading and alignment, wafer leveling, and automatic tool calibrations. The listed capabilities include a 200 mm wafer stage, 0.45 NA optics, a 15 mm exposure field, and die-by-die alignment.

What can it run?

Process applications and technology nodes documented for this tool.

Photolithography
Wafer exposure

What do the numbers mean?

Wafer handling5

Machine name: AutoStep 200 DSW i-line Wafer Stepper^[1]
Maximum wafer size: up to 200 mm wafers^[1]
Wafer stage: 200 mm Wafer Stage^[1]
Automation: All operations are automated, including wafer loading, aligning, reticle loading and aligning^[1]
Wafer leveling: Used to provide optimum focus range^[1]

Optics & imaging6

Optics NA: 0.45 N.A.^[1]
Lens: Tropel i-line Lens^[1]
Exposure field: 15 mm^[1]
Illumination: Annular and Quadrupole illumination available^[1]
Focus compensation: Compensated for lens heating and barometric shifts^[1]
Reticle management: Reticle Management System (up to 10 reticles)^[1]

Performance3

Alignment: uDFAS Die-by-Die Alignment^[1]
Overlay specification: <0.125 µm using local alignment^[1]
Focus repeatability: <0.2 µm^[1]

Configuration & options5

Model: AS200^[1]
OEM: GCA^[1]
Reduction: 5X^[1]
Feature size specification: 0.65 µm features^[1]
Automatic calibrations: All tool calibrations are performed automatically^[1]

Interested in this tool?

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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

ASML PAS 5500— Same function class: Lithography, 200mmCompare in depthsource^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the AS200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AS200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AS200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AS200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AS200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AS200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources

[1]cnfusers.cornell.edu — cnfusers.cornell.educnfusers.cornell.edu
[2]nist.govnist.gov
[3]https://www.cnfusers.cornell.edu/sites/default/files/Equipment-Resources/General%20Information%20Sheets_1.pdf — cnfusers.cornell.educnfusers.cornell.edu
[4]https://www.cnfusers.cornell.edu/sites/default/files/Equipment-Resources/General%20Information%20Sheets_2.pdf — cnfusers.cornell.educnfusers.cornell.edu

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Last updated Jul 29, 2026.

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