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Comparison ledger

1 EC 101 R 485 Photoresist Spinnerversus3303 Lift Off

Headway 1 EC 101 R 485 Photoresist Spinner, Veeco 3303 Lift Off, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMHeadwayVeeco
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeadway 1 EC 101 R 485 Photoresist SpinnerVeeco 33xx
Specifications
Vacuum requirement23" Hg[1]—
Electrical115 V, 3 A, 50/60 Hz, 1 Ø (single phase)[1]—
Electrical power115 V, 3 A, 50/60 Hz, 1 Ø (single phase)[1]—
HPC solvent lift off process—500-2300 PSI1)[2]
Configuration—HVS (High Velocity Spray) Chamber up to 40 PSI[2]
Model—3303[2]
Machine type—Lift Off Machine[3]
Wafer size—6 inch[2]
Process—HPC solvent lift off process[2]
Process pressure—500-2300 PSI[2]
Chamber pressure—up to 40 PSI[3]
OEM—Veeco / SSEC[2]
HVS chamber pressure—up to 40 PSI[2]
Vintage—2006[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com