Waferpedia

Comparison ledger

1088versus1809 MK 5

Heller 1088, Heller 1809 MK 5, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
1088Heller
1809 MK 5Heller
OEMHellerHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeller 1088Heller 1809 MK 5
Specifications
Heating Zones8 zones (4 top and 4 below) plus 1 cooling zone[1]—
Heating MethodForced convection[1]—
Conveyor Width18 inches (45 cm)[1]—
Heated Length43.5 inches (111 cm)[1]—
Overall Length96 inches (244 cm)[1]—
Height50 inches (127 cm)[1]—
Net Weight900 lbs (409 kg)[1]—
Thermal ProfilerIncluded[1]—
Oven TopCounter balance for easy access to conveyor[1]—
Solder CompatibilityLead-free and leaded soldering[1]—
OEM—Heller[2]
Model—1809 MK 5[2]
Equipment type—Reflow oven[2]
Category—Thermal / Diffusion[3]
Description—SMT reflow soldering oven[4]
Overall length—183 in[4]
Max PCB width—22 in[4]
Heating zones—9[4]
Cooling zones—2[4]
Dimensions—465 x 137 x 160 cm[5]
Heated length—254 cm[5]
Typical power consumption—7.5 - 16 kW[5]
Max conveyor speed—188 cm/min[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]smtdevices.comsmtdevices.com
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]efsmt.comefsmt.com
  5. [5]amtest-smt.comamtest-smt.com