Comparison ledger
Hesse & Knipps BJ 820 V 1 Wedge, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | BJ 820 V 1 WedgeHesse & Knipps | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Hesse & Knipps | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hesse & Knipps BJ 820 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | 45* Bond Head[1] | — |
| Bond head angle | 45°[2] | — |
| Fine wire maximum | 2.7 mils[2] | — |
| Software | Latest installed[2] | — |
| Detachable microscopes | Yes[2] | — |
| OEM | Hesse & Knipps (H&K)[1] | — |
| Model | BJ 820 V 1[1] | — |
| Machine type | Wedge Bonder[2] | — |
| Category | Packaging & Bonding[2] | — |
| Wafer Size | — | 6 inch[3] |
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