Hesse & Knipps

Plate 01HESSE Thin Wedge Bonder BJ820 Multi stitch looping Repeatability Sim
Plate 02HESSE Thin Wedge Bonder BJ820 Fast Bonding
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the BJ 820 V 1 Wedge are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BJ 820 V 1 Wedge are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the BJ 820 V 1 Wedge are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the BJ 820 V 1 Wedge are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the BJ 820 V 1 Wedge are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the BJ 820 V 1 Wedge is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 29, 2026.
General referenceThe ASM AB 559 A 06 Wedge is a packaging and bonding machine class used to make wire bonds between semiconductor devices and their packages or interconnect structures. It belongs to the class of wedge bonding systems used in assembly operations.
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.