Waferpedia

Comparison ledger

BJ 959 Heavyversus10100

Hesse & Knipps BJ 959 Heavy, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
BJ 959 HeavyHesse & Knipps
10100West Bond
OEMHesse & KnippsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHesse & Knipps (H&K) BJ 959 HeavyWest Bond 10100
Specifications
ConfigurationHesse RBK 03 X 2277[1]—
Voltage230 V AC[1]—
Phase1 Phase[1]—
TypeHeavy wire bonder[1]—
Bonding methodWedge bonder[2]—
Machine typeFully automatic heavy wire wedge bonder[3]—
Operation modeFully automatic machine or manual operation[3]—
Wire size50 μm – 600 μm (2 mil – 24 mil) for Al, Cu, AlCu[3]—
Copper wire size50 to 600 µm[2]—
Ribbon size250 µm x 25 µm up to 2000 µm x 400 µm (Cu: 200 µm)[3]—
Ribbon size (semiconductor directory)250 x 25 µm up to 2000 x 400 µm[2]—
Working area X370 mm[3]—
Working area Y560 mm[3]—
Working area Z42 mm[3]—
Motorized X and Y travel370 x 560 mm[2]—
Motorized Z travel42 mm[2]—
P-rotation440°[3]—
Footprint (W x D x H)805 x 1634 x 1912 mm[3]—
Overall dimensions805 x 1634 x 1912 mm[2]—
Weightca. 1300 kg[3]—
Net weight1300 kg[2]—
Power supply230V AC[3]—
Power supply (semiconductor directory)230V AC[2]—
Media connectivityGigabit-Ethernet (TCP/IP), USB-Ports, HDMI, Compressed air (CDA clean, dry air), Vacuum[3]—
Bondhead frequency60 kHz* for HBK heavy wire bondhead; 57 kHz* for RBK ribbon and RBK Copper bondheads (* exact range of frequencies on request)[3]—
Bondhead wire range50 μm – 600 μm** for Al, Cu, AlCu (**depending on application and wire)[3]—
Configuration (specific unit)Hesse RBK 03 X 2277; Lexical M 50 Stereo Microscope with Adapter Arm[1]—
Vintage (specific unit)2021[1]—

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semiconductor.directorysemiconductor.directory
  3. [3]hesse-mechatronics.comhesse-mechatronics.com