Comparison ledger
Hesse & Knipps Bondjet 820, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Bondjet 820Hesse & Knipps | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Hesse & Knipps | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hesse & Knipps Bondjet 820 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Power | U 230V[1] | — |
| Configuration | 50/60 Hz[1] | — |
| Voltage | 230 V[2] | — |
| OEM | Hesse & Knipps (H&K)[1] | — |
| Model | Bondjet 820[1] | — |
| Equipment type | Bonder[1] | — |
| Description | Automatic fine wire wedge bonder[3] | — |
| Vintage | 2008[1] | — |
| Working area | 305 mm x 410 mm[3] | — |
| Axis repeatability | 1 micron at 3 sigma[3] | — |
| Wire diameter | 17.5 μm to 60 μm[3] | — |
| Axes | 4 axes (X, Y, Z, Theta)[3] | — |
| Wafer Size | — | 6 inch[4] |
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