Bondjet 820

The Hesse & Knipps Bondjet 820 is a bonder used in semiconductor packaging and interconnect assembly. Wire bonders of this class create electrical connections between a die and a package or substrate by attaching fine wire to designated bond pads.

Wedge bonders use a bonding tool to press and ultrasonically scrub a wire onto a bond surface, then form a loop and make a second bond at another location before terminating the wire. Automatic fine wire systems in this class combine motion control, optical alignment, wire feed, and bond quality monitoring to execute repeated interconnect patterns.

Wire bonders are used in back end semiconductor assembly after die attach or other substrate preparation has positioned the device for interconnection. Wire bonding is followed by downstream packaging steps such as encapsulation, lid attach, singulation, and final electrical test, depending on the package flow.

Fine wire wedge bonders are used where small interconnect wires must join semiconductor devices to package leads, metallized substrates, or similar contact structures. Machines in this class are used for microelectronic packaging, device assembly, and related interconnect work that depends on controlled wire placement and repeatable bond formation.