Comparison ledger
Hesse & Knipps Bondjet BJ 820 Rotary Bond Head, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Bondjet BJ 820 Rotary Bond HeadHesse & Knipps | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Hesse & Knipps | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hesse & Knipps (H&K) Bondjet BJ 820 Rotary Bond Head | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | for RF360 EPCOS[1] | — |
| OEM | Hesse & Knipps (H&K)[1] | — |
| Model | Bondjet BJ 820[1] | — |
| Type | Rotary bond head[2] | — |
| Category | Packaging & Bonding[2] | — |
| Configuration / option | For RF360 EPCOS[2] | — |
| Bonding modes | Round wire and deep access ribbon and wire bonding[3] | — |
| Reported speed | Up to 7 wires/sec[3] | — |
| Work area | 12 in x 16.1 in[3] | — |
| Footprint | 720 x 1250 mm[3] | — |
| Wafer Size | — | 6 inch[4] |
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