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Comparison ledger

Bondjet BJ 820 Rotary Bond Headversus10490

Hesse & Knipps Bondjet BJ 820 Rotary Bond Head, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMHesse & KnippsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHesse & Knipps (H&K) Bondjet BJ 820 Rotary Bond HeadWest Bond 10490
Specifications
Configurationfor RF360 EPCOS[1]—
OEMHesse & Knipps (H&K)[1]—
ModelBondjet BJ 820[1]10490[4]
TypeRotary bond head[2]—
CategoryPackaging & Bonding[2]—
Configuration / optionFor RF360 EPCOS[2]—
Bonding modesRound wire and deep access ribbon and wire bonding[3]Wedge bonding and ball bonding[6]
Reported speedUp to 7 wires/sec[3]—
Work area12 in x 16.1 in[3]—
Footprint720 x 1250 mm[3]—
Manufacturer—West Bond[4]
Description—Convertible bonder, wedge to ball[5]
Tool type—Convertible bonder[6]
Use—Wire bonding[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]circuitsassembly.comcircuitsassembly.com
  4. [4]Equipment inventory listing
  5. [5]fabsurplus.comfabsurplus.com
  6. [6]waferpedia.comwaferpedia.com