Comparison ledger
Hesse & Knipps LW2095, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | LW2095Hesse & Knipps | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Hesse & Knipps | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hesse & Knipps LW2095 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Product type | Laser Welder[1] | — |
| Machine type | Fully automatic laser welding system with two weldheads and an extra large working area[2] | — |
| Working area | 2400 mm × 1400 mm × 45 mm (X×Y×Z)[2] | — |
| P-rotation | 360°[2] | — |
| Laser beam source per weldhead | 1.5 kW[2] | — |
| Beam source max power | 1.5 kW, cw[2] | — |
| Laser beam quality | Single Mode[2] | — |
| Wavelength | 1070 nm[2] | — |
| Optics max working area | 12 mm × 12 mm[2] | — |
| Optics max power | 1.3 kW, cw[2] | — |
| Permissible wavelength | 1070 nm[2] | — |
| Focus spot diameter | < 50 µm[3] | — |
| Down hold force | up to 120 N[2] | — |
| Touchdown detection | Included[2] | — |
| Max. immersion depth | 94 mm[2] | — |
| Process monitoring | Sensors for process illumination (plasma, thermal illumination and backscattered radiation)[2] | — |
| Interfaces | OPC-UA, Profinet[2] | — |
| Footprint | 4434 x 3000 x mind. 2460 mm[2] | — |
| External switch cabinet | 1800 x 600 x 2200 mm[2] | — |
| Laser switch cabinet | 600 x 600 x 2000 mm[2] | — |
| Service stations | Tool force calibration module; E-Box station for laser beam alignment; tool changing station; integrated beam shape measurement and focus position determination; off-bond station for welding samples[2] | — |
| Wafer Size | — | 6 inch[4] |
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