Comparison ledger
Hitachi 1305 BSG 3, SUSS MicroTec SD 12 Semi-Automatic Wet Processing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | SD 12 Semi-Automatic Wet ProcessingSUSS MicroTec |
|---|---|---|
| OEM | Hitachi | SUSS MicroTec |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | SUSS MicroTec SD 12 Semi-Automatic Wet Processing |
| Specifications | ||
| Configuration | — | IPC With Touch Screen[1] |
| Operating System, | — | Microsoft Windows 10[1] |
| Speed | — | Up to 3.000 rpm (Depending on Substrate Size and Load)[1] |
| Acceleration | — | Programmable[1] |
| Spinning Time | — | 0.1 up to 999s[1] |
| OEM | — | SUSS[1] |
| Model | — | SD 12 Semi-Automatic Wet Processing[1] |
| Control interface | — | IPC with touch screen[1] |
| Process chamber | — | Stainless steel[1] |
| Dispense arm | — | Motorized[1] |
| Connection | — | Ethernet link[1] |
| Safety package | — | Solvent[1] |
| Back side rinse | — | Included[1] |
| Drying | — | Nitrogen drying[1] |
| Filter unit | — | Solvent filter unit[1] |
| Media storage | — | SS EX[1] |
| Solvent developer insert ring | — | R6-R8-BSR[1] |
| Power | — | 50/60 Hz, 3x400 VAC[1] |
| Spinning time | — | 0.1 to 999 s[1] |
| CDA purge | — | Included for spin light tower[1] |
| Tool status display | — | Red, yellow, blue[1] |
| Vacuum chuck | — | R6 with exchangeable centering pins for 150 mm and 152 mm round SEMI standard wafers[1] |
| Pressure tank system | — | 10 L stainless steel tank with empty, low, full, and overfull sensors; quick connector for manual filling; pressure regulated with gauge; maximum pressure 2.5 bar[1] |
| Waste canister | — | 20 L stainless steel waste tank with full and overfull level sensor; spill pan with leakage sensor included[1] |
| Tape frame vacuum chuck | — | For 150 mm wafer[1] |
| Dispense system | — | FFKM dispense system 660 / Puddle & FANSPRAY[1] |
| Max Pressure | — | 2.5 bar[1] |
| Wafer size | — | For 150 mm Wafer FFKM[1] |
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