Comparison ledger
Hitachi CG 4100, Nikon S-210, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | CG 4100Hitachi | S-210Nikon |
|---|---|---|
| OEM | Hitachi | Nikon |
| Category | — | — |
| Wafer size | Wafer Equipment | Wafer Equipment |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi CG 4100 | Nikon S-210 |
| Specifications | ||
| Wafer size | Wafer Equipment[1] | Wafer Equipment[2] |
| Date of Manufacture | 2013-01-01[1] | — |
| Currently Configured for | 300mm[1] | — |
| Missing or Damaged parts | Fab confirmed there were no missing or damaged parts.[1] | — |
| Vendor | HITACHI[1] | — |
| VID | VID761[1] | — |
| SW Version | 35.47[1] | — |
| Resolution | 1.8nm[1] | — |
| throughput | 42wafer/h[1] | — |
| MAM Time | 2.8sec[1] | — |
| Stage Landing Accuracy | ±1μm[1] | — |
| Power | — | 200VAC 50/60Hz 3 Phase[2] |
| Manufacturer | — | Nikon[2] |
| Model | — | S-210[2] |
| Condition | — | Used[2] |
| Year(s) | — | 2014[2] |
| Quantity | — | 1[2] |
| Location | — | EUROPE (Western and Northern)[2] |
| Status note | — | Still in the fab running wafers[2] |