Comparison ledger
KLA 0035235-003 MMD Head, Onto Innovation MP 300 XCU Cu Film Thickness Measurement, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | MP 300 XCU Cu Film Thickness MeasurementOnto Innovation | |
|---|---|---|
| OEM | KLA | Onto Innovation |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | Onto Innovation MP 300 XCU Cu Film Thickness Measurement |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | MP 300 XCU[2] |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Type | — | Cu Film Thickness Measurement[2] |
| OEM | — | ONTO / Rudolph[2] |
| Wafer Size | — | 12 inch[2] |
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