Waferpedia

Comparison ledger

200 versus P 22 H Surface

KLA 200 and KLA P 22 H Surface, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
200KLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyKLA 200KLA P
Specifications
Supported equipment familyKLA 200 series pattern inspection stations[1]
Related supported equipmentKLA Tencor 300 Series Pattern Inspection Stations, STARlight tools, and URSA tools[1]
Data hub function9X Fileservers are central data hubs serving KLA Tencor reticle inspection equipment[1]
Software function9X System Software supports storage and retrieval of setup and result files and several analysis functions[1]
ConfigurationStep Height Precision Micro 2D Scanner[2]
Scan Length60 mm[2]
Scan Speed1 um/sec to 25mm/ sec[2]
Scan MethodBi-directional moving stylus[2]
Sampling Rate5, 10, 20, 50, 100, 200, 500 , 1000 Hz[2]
Stylus ForceAdjustable between 0.05 ~ 50mg[2]
Step Height Repeatability, 10.75 nm or 0.1%:Sample Handling:[2]
Theta360[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing