Comparison ledger
KLA 2132 and KLA 2135, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2132KLA | 2135KLA |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 2132 | KLA 2135 |
| Specifications | ||
| Product type | Wafer inspection system[1] | wafer inspection system[1] |
| Relationship to KLA 2135 | Earlier model than the KLA 2135[1] | — |
| Wafer size (primary) | 200mm (8")[2] | — |
| Wafer size (alternate) | 4", 5", 6" capable[2] | — |
| Throughput | 2–8 wafers per hour[2] | two- to three-times throughput improvement over the earlier model KLA 2132[1] |
| Sensitivity | >0.25 µm pixels[2] | — |
| Inspection type | Patterned wafer defect inspection[2] | — |
| Optics | Brightfield, small-pixel, high data rate digital image processing[1] | — |
| User interface | DOS operating system[3] | — |
| SAT capability | Segmented Auto Threshold (SAT) included[2] | — |
| Calibration wafer | 8" DSW calibration wafer included[2] | — |
| Vintage (year of introduction) | 1995[2] | — |
| Technology | — | advanced sensor and image processing technologies[1] |
| Inspection method | — | brightfield, small-pixel, high data rate, digital image processing technology[1] |
| Defect detection | — | detects all types of yield-relevant defects on all process layers[1] |
| Operational use | — | in-line monitoring of advanced processes[1] |
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