Comparison ledger
KLA 2132 and KLA P 22 H Surface, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2132KLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 2132 | KLA P |
| Specifications | ||
| Product type | Wafer inspection system[1] | — |
| Relationship to KLA 2135 | Earlier model than the KLA 2135[1] | — |
| Wafer size (primary) | 200mm (8")[2] | — |
| Wafer size (alternate) | 4", 5", 6" capable[2] | — |
| Throughput | 2–8 wafers per hour[2] | — |
| Sensitivity | >0.25 µm pixels[2] | — |
| Inspection type | Patterned wafer defect inspection[2] | — |
| Optics | Brightfield, small-pixel, high data rate digital image processing[1] | — |
| User interface | DOS operating system[3] | — |
| SAT capability | Segmented Auto Threshold (SAT) included[2] | — |
| Calibration wafer | 8" DSW calibration wafer included[2] | — |
| Vintage (year of introduction) | 1995[2] | — |
| Configuration | — | Step Height Precision Micro 2D Scanner[4] |
| Scan Length | — | 60 mm[4] |
| Scan Speed | — | 1 um/sec to 25mm/ sec[4] |
| Scan Method | — | Bi-directional moving stylus[4] |
| Sampling Rate | — | 5, 10, 20, 50, 100, 200, 500 , 1000 Hz[4] |
| Stylus Force | — | Adjustable between 0.05 ~ 50mg[4] |
| Step Height Repeatability, 1 | — | 0.75 nm or 0.1%:Sample Handling:[4] |
| Theta | — | 360[4] |
Plan your fab
Building a Metrology & Inspection process? Get a complete equipment list.
Open the fab equipment planner →