Waferpedia

Comparison ledger

2133 Brightfield versus P 22 H Surface

KLA 2133 Brightfield and KLA P 22 H Surface, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer sizeWafer Transfer
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyKLA 21xxKLA P
Specifications
Configuration2 x 25 Auto Load[1]Step Height Precision Micro 2D Scanner[2]
Wafer sizeWafer Transfer[1]
Process Vac23 InHg[1]
Inlet Power3 line of 208 Vac 20 Amp[1]
CDA100 PSI[1]
Exhaust for CoolingBlower[1]
Scan Length60 mm[2]
Scan Speed1 um/sec to 25mm/ sec[2]
Scan MethodBi-directional moving stylus[2]
Sampling Rate5, 10, 20, 50, 100, 200, 500 , 1000 Hz[2]
Stylus ForceAdjustable between 0.05 ~ 50mg[2]
Step Height Repeatability, 10.75 nm or 0.1%:Sample Handling:[2]
Theta360[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing