Comparison ledger
KLA 2135 and KLA 2351, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2135KLA | 2351KLA |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | Wafer Transfer System |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 2135 | KLA 2351 |
| Specifications | ||
| Product type | wafer inspection system[1] | — |
| Technology | advanced sensor and image processing technologies[1] | — |
| Inspection method | brightfield, small-pixel, high data rate, digital image processing technology[1] | — |
| Defect detection | detects all types of yield-relevant defects on all process layers[1] | — |
| Operational use | in-line monitoring of advanced processes[1] | — |
| Throughput | two- to three-times throughput improvement over the earlier model KLA 2132[1] | — |
| Configuration | — | With HDD & Software[2] |
| Load Port Qty | — | 2[2] |
| Wavelength Illumination | — | 370~720 nm[2] |
| Wavelength Band | — | Visible, UV[2] |
| Pixel Size | — | 0.16μm / 0.20μm / 0.25μm / 0.39μm / 0.62μm[2] |
| Array Defect Capture Rate | — | ≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[2] |
| Array False Defect Rate | — | ≤1.5%(all sizes)[2] |
| Random Defect Capture Rate | — | ≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[2] |
| Random False Defect Rate | — | ≤1.5% (all sizes)[2] |
| Repeatability | — | ≥90% (20 consecutive run on the same DSW wafer)[2] |
| Wafer size | — | Wafer Transfer System[2] |
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