Comparison ledger
KLA 2135 and KLA P-15, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2135KLA | P-15KLA |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 2135 | KLA P-15 |
| Specifications | ||
| Product type | wafer inspection system[1] | — |
| Technology | advanced sensor and image processing technologies[1] | — |
| Inspection method | brightfield, small-pixel, high data rate, digital image processing technology[1] | — |
| Defect detection | detects all types of yield-relevant defects on all process layers[1] | — |
| Operational use | in-line monitoring of advanced processes[1] | — |
| Throughput | two- to three-times throughput improvement over the earlier model KLA 2132[1] | — |
| Sample table | — | 200 mm sample table with vacuum[2] |
| Measurement range | — | Measures steps from 100 Å to 300 µm[2] |
| Maximum sample thickness | — | 20 mm[2] |
| Minimum sample length | — | 25 mm[2] |
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