Comparison ledger
KLA 2135 and KLA P-17, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2135KLA | P-17KLA |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 2135 | KLA P-17 |
| Cited variants | — |
|
| Specifications | ||
| Product type | wafer inspection system[2] | — |
| Technology | advanced sensor and image processing technologies[2] | — |
| Inspection method | brightfield, small-pixel, high data rate, digital image processing technology[2] | — |
| Defect detection | detects all types of yield-relevant defects on all process layers[2] | — |
| Operational use | in-line monitoring of advanced processes[2] | — |
| Throughput | two- to three-times throughput improvement over the earlier model KLA 2132[2] | — |
| Instrument type | — | Mechanical profilometer[3] |
| Z range | — | 1 mm[3] |
| Vertical resolution | — | 0.6 Å[3] |
| Lateral resolution | — | 0.5 µm[3] |
| Step height range | — | Nanometers to 1000 µm[1] |
| Constant force control | — | 0.03 to 50 mg[1] |
| Scan length (without stitching) | — | 200 mm[1] |
| Video camera | — | 5 MP high-resolution color[1] |
| Stylus tip radius options | — | 40 nm to 50 µm[4] |
| Stylus included angle options | — | 20 to 100 degrees[4] |
| Sample chuck range | — | 50 to 200 mm[1] |
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