Comparison ledger
KLA 2138 and KLA P-2, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2138KLA | P-2KLA |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 2138 | KLA P-2 |
| Specifications | ||
| Product name | KLA-2138[1] | — |
| Type | Wafer Inspection System[1] | — |
| Technology | Ultra-Broadband Technology[1] | — |
| Illumination source | Ultra-broadband (UBB) illumination source[1] | — |
| Optics | Significantly improved brightfield optics[1] | — |
| Detection technology | Segmented Auto Threshold (SAT) technology[1] | — |
| Optional configuration | Integrated SMIF minienvironment[1] | — |
| Model | — | P-2[2] |
| OEM | — | KLA Tencor[2] |
| Equipment type | — | Profilometer[2] |
| Sample table | — | 200 mm sample table with vacuum[3] |
| Measurement range | — | Measures steps from 100 Å to 300 µm[3] |
| Maximum sample thickness | — | 20 mm[3] |
| Minimum sample length | — | 25 mm[3] |
| Feature | — | 3D scan option[3] |
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